DZR-S typedicing blade is composed of metal nickel and diamond abrasive, which has the characteristics of fast heat dissipation, good chip removal performance and excellentdicing performance. It can be widely used for cutting and processing of various hard and brittle materials and semiconductor packaging components. Such as: PCB substrate, ceramic substrate, etc.
The selected diamond abrasive is used to make theblades have excellentdicing performance and long service life.
The use of advanced manufacturing technology can optimize the hardness, geometric shape and abrasive distribution of the blade. The control of the concentration of diamond abrasive and the bond effectively reduces the probability of burr duringdicing.