DZR-S型划片刀由金属镍与金刚石磨料组成，具有散热快、排屑性能好、切割性能优良等特点。
能广泛适用于各种硬脆材料、半导体封装原件的切割加工。如:PCB基板、陶瓷基板等。
采用精选的金刚石磨料，使划片刀具有卓越的切削性能和超长的使用寿命。
采用先进的制造工艺能使刀片的硬度、几何形状，磨料分布达到最优化。对金刚石磨料的浓度和结合剂的控制，有效降低了切割时毛边发生的概率。
DZR-S typedicing blade is composed of metal nickel and diamond abrasive, which has the characteristics of fast heat dissipation, good chip removal performance and excellentdicing performance. It can be widely used for cutting and processing of various hard and brittle materials and semiconductor packaging components. Such as: PCB substrate, ceramic substrate, etc.
The selected diamond abrasive is used to make theblades have excellentdicing performance and long service life.
The use of advanced manufacturing technology can optimize the hardness, geometric shape and abrasive distribution of the blade. The control of the concentration of diamond abrasive and the bond effectively reduces the probability of burr duringdicing.