DZR型划片刀由金属镍与金刚石磨料组成，具有超薄、切割性能优良等特点。能对各种硬脆非金属进行开槽和切断。
如:半导体晶圆、功能陶瓷、合金材料、半导体封装材料。
采用精选的金刚石磨料，使划片刀具有卓越的切削性能和超长的使用寿命。
采用先进的制造工艺对金刚石磨料的浓度和结合剂的控制，有效降低了切割时材料崩边发生的概率。

DZR type dicing blade is composed of metal nickel and diamond abrasive, which has the characteristics of ultra-thin and excellent dicing performance. Capable of slotting and dicing various hard and brittle nonmetals.
Such as: semiconductor wafer, functional ceramics, alloy materials, semiconductor packaging materials.
The selected diamond abrasive is used to make the blades have excellent dicing performance and long service life.
Advanced manufacturing technology is adopted to control the concentration of diamond abrasive and the bond, which effectively reduces the probability of material edge collapse during dicing.