SZ系列树脂刀

此砂轮片是由耐高温树脂粉及辅助添加材料与金刚石混合烧结而成的一种超精切割刀片。适合对半导体材料、陶瓷材料，以及玻璃、水晶、石英等材料进行切割。

This grinding wheel is a kind of ultra-precision dicing blade which is sintered by mixing high temperature resistant resin powder and auxiliary materials with diamond. Suitable fordicing semiconductor materials, ceramic materials, glass, crystal, quartz and other materials.