UV膜

UDT-8055系列
PO基材，主要针对晶圆产品的切割应用。
UDT-09010系列
PO基材，适合晶圆和镀膜玻璃产品以及部分封装PCB类产品。
UDT-15010系列
PO基材，中高粘性，适合半导体封装基板类小颗粒产品切割，例如DFN产品。
UDT-15020系列
PO基材，高粘性，主要针对半导体封装的基板类和陶瓷基板等，最适合基板曲翘度大的产品使用。
UDT-10020系列
PET基材，UV后粘性极低，剥离性优越，适合陶瓷类和玻璃类产品。

UDT-8055 series
PO substrate, mainly for the dicing application of wafer products.
UDT-09010 series
PO substrate, suitable for wafer and coated glass products as well as some packaged PCB products.
UDT-15010 series
PO substrate, medium and high viscosity, suitable for dicing small particle products such as semiconductor packaging substrate, such as DFN products.
UDT-15020 series
PO substrate, high viscosity, mainly for semiconductor packaging substrates and ceramic substrates, is most suitable for products with large substrate warpage.
UDT-10020 series
PET substrate has very low viscosity after UV and excellent peeling property, which is suitable for ceramic and glass products.